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S. Biswas ¹, B. R. Sarkar ¹, B. Doloi ¹, B. Bhattacharyya ¹

Affiliations
1 Production Engineering Department, Jadavpur University, Kolkata-700032, IN

Abstract

Manufacturing of the better quality ceramic products with more accuracy and precision is a great challenge in the current industrial field. Electrically non-conducting materials like ceramics, composites, alumina, glass etc can be machined easily using Electrochemical Discharge Machining (ECDM) process. The performance characteristics of ECDM process e.g. material removal rate (MRR), machining depth rate (MDR), radial overcut (ROC) and heat affected zone (HAZ) are influenced by various process parameters such as applied voltage, inter-electrode gap, temperature, concentration of the electrolyte, type of electrolyte, shape, size and material of the electrode and also the nature of the power supply etc. This paper presents the optimization of m-EDMing of Silicon Nitride by utilizing Multi-Objective Optimization by Ratio Analysis (MOORA). Also, a multi choice decision analysis i.e. Analytic Hierarchy Process (AHP) is applied for optimization.

Keywords

μ-ECDM, MRR, MDR, ROC, HAZ, MOORA.

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B. Mallick ¹, B. R. Sarkar ¹, B. Doloi ¹, B. Bhattacharyya ¹

Affiliations
1 Production Engineering Department, Jadavpur University, Kolkata-700032, IN

Abstract

Travelling Wire Electrochemical Discharge Machining (TW-ECDM) process is a special type of Electrochemical Spark Machining (ECSM) process which has a greater effectiveness for machining of electrically non-conducting material like hylam based fiber reinforced plastics (FRP). The recent research paper focuses the parametric analysis on machining criteria such as material removal rate (MRR) and Overcut (OC) for slot cutting operation considering applied voltage, electrolyte concentration, feed rate of wire and pulse on time etc as process parameters. This paper shows the single and multi-objective optimization for determining the optimal parametric combination of TWECDM for maximum MRR and minimum OC based on response surface methodology (RSM). From the parametric analyses it is concluded that applied voltage has more significant effects on MRR and OC during TW-ECDM slot cutting operation.

Keywords

TW-ECDM, ECSM, MRR, OC, RSM.

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B. R. Sarkar ¹, B. Doloi ¹, B. Bhattacharyya ¹

Affiliations
1 Production Engineering Department, Jadavpur University, Kolkata-700 032, IN

Abstract

The electrochemical discharge machining (ECDM) process is a non-conventional, thermoelectric, hybrid machining process, which uses electrochemical discharge phenomenon and has a great potential to machine an electrically non-conducting engineering ceramic like Silicon Nitride (Si3N4). The present research paper highlights on the development of a second order non-linear mathematical model that establishes a relationship between the penetration rate and different process parameters such as applied voltage, electrolyte concentration and inter-electrode gap utilising the experimentally obtained data during micro-drilling of silicon nitride by electrochemical discharge machining process. The experimentation has been conducted according to the central composite second order rotatable design based on Response Surface Methodology (RSM). The analysis of variance (ANOVA) has been performed to verify the adequacy of the aforesaid polynomial mathematical model. The parametric effects have also been studied based on the developed mathematical model for obtaining optimal penetration rate during micro-drilling of Silicon Nitride by ECDM process.

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